Phoenix Contact MCV 1.5/12-GF-3.5

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Product Weight (g)

3.76

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8536.69.40.40

Automotive

No

PPAP

No

Termination Method

Solder

Terminal Pitch (mm)

3.5

Body Orientation

Straight

Maximum Current Rating (A)

8

Maximum Voltage Rating

160V

Insulation Resistance (MOhm)

5

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

100

Mating Cycle (Cycles)

25

Product Depth (mm)

7.25

Tail Length (mm)

3.4

Mounting

Through Hole

Voltage Rating Max

160V

Number of Contact Rows

1

Operating Temp Range

-40C to 100C

Mounting Styles

Through Hole

Contact Materials

Copper Alloy

Pitch (mm)

3.5(mm)

Pitch Spacing

3.5mm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cardboard

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Wire to Board

Number of Rows

1

Gender

HDR

Number of Contacts

12

Housing Color

Green

Rated Current

8A

Current Rating (Max)

8(A)

Rated Voltage

300V

Product Length (mm)

52.3

Product Height (mm)

9.2