Philips BZV55-C27

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Material

Aluminum

Shape

Square, Fins

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Material Finish

Blue Anodized

Reference Voltage-Nom

27 V

Operating Temperature-Max

200 °C

Rohs Code

Yes

Manufacturer Part Number

BZV55-C27

Power Dissipation (Max)

0.5 W

Manufacturer

Philips Semiconductors

Number of Elements

1

Part Life Cycle Code

Transferred

Ihs Manufacturer

PHILIPS SEMICONDUCTORS

Risk Rank

5.73

Series

pushPIN™

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Top Mount

Terminal Finish

Matte Tin (Sn)

Subcategory

Voltage Reference Diodes

Reach Compliance Code

unknown

Configuration

SINGLE

Attachment Method

Push Pin

Height Off Base (Height of Fin)

0.236 (6.00mm)

Thermal Resistance @ Forced Air Flow

15.95°C/W @ 100 LFM

Diode Type

ZENER DIODE

Voltage Tol-Max

5%

Working Test Current

2 mA

Dynamic Impedance-Max

80 Ω

Thermal Resistance @ Natural

--

Power Dissipation @ Temperature Rise

--

Width

1.969 (50.00mm)

Length

1.969 (50.00mm)

Diameter

--