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Penchem Technologies Sdn Bhd TH994-288-192-1.5
TH994-288-192-1.5
-
69853583-TH994-288-192-1.5
THERM PAD 288MMX192MM GRAY
- MaterialSilicone
- ShapeRectangular
- SeriesTH994
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Sheet - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - TypeGap Filler Pad, Sheet
- ColorGray
- UsageThermally Conductive
- AdhesiveTacky - Both Sides
- Outline288.00mm x 192.00mm
- Thermal Conductivity
a measure of a material's ability to?conduct heat.?
8.0W/m-K - Thickness0.0591" (1.500mm)
Quantity
Unit Price
Ext. Price
1+
$4,812.042427
$4,812.01
10+
$4,539.662694
$45,396.60
100+
$4,282.700643
$428,270.02
500+
$4,040.283617
$2,020,141.75
1000+
$3,811.588301
$3,811,588.35
* The above prices does not include taxes and freight rates, which will be calculated on the order pages.
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