Pasternack PE2CP1125-30

Package / Case

Module

Supplier Device Package

Module

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bag

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Applications

5G, GSM, LTE

Frequency

8GHz ~ 40GHz

Power - Max

30W

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

1dB

Coupler Type

Standard

Coupling Factor

Coupling Factor (CF) measures the coupling between classes excluding coupling due to inheritance. It is the ratio between the number of actually coupled pairs of classes in a scope (e.g., package) and the possible number of coupled pairs of classes. CF is primarily applicable to object-oriented systems.

30dB