Panjit BAS70TW_S2_00001

Mounting Type

Surface Mount

Package / Case

6-TSSOP, SC-88, SOT-363

Supplier Device Package

SOT-363

Factory Pack QuantityFactory Pack Quantity

560

Manufacturer

Aptiv

Brand

Aptiv (formerly Delphi)

RoHS

Details

Unit Weight

0.000280 oz

Package

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Base Product Number

BAS70TW

Mfr

Panjit International Inc.

Product Status

Active

Current - Average Rectified (Io) (per Diode)

200mA (DC)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

SSM-02TS

Subcategory

Automotive Connectors

Technology

Si

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Type

Schottky

Current - Reverse Leakage @ Vr

100 nA @ 50 V

Voltage - Forward (Vf) (Max) @ If

1 V @ 15 mA

Operating Temperature - Junction

-55°C ~ 125°C

Voltage - DC Reverse (Vr) (Max)

70 V

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Automotive Connectors

Diode Configuration

3 Independent

Reverse Recovery Time (trr)

5 ns

Product Category

a particular group of related products.

Automotive Connectors