FPAD

Panduit Corp FPAD

Part No:

FPAD

Manufacturer:

Panduit Corp

Datasheet:

FPAD Drawing

Package:

-

ROHS:

AINNX NO:

1517941-FPAD

Description:

Cable Accessories Polishing Pad

Products specifications
  • Factory Lead Time
    4 Weeks
  • Mount
    Cable
  • Weight
    0.295lb 133.81g
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Published
    2005
  • Size / Dimension
    5.70Lx5.70W 144.8mmx144.8mm
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    Not Applicable
  • Type
    Polishing Plate
  • Length
    144.78mm
  • Width
    144.78mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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