Panduit Corp CBP25-M

Factory Lead Time

4 Weeks

Mounting Type

Snap Lock

Material

Nylon

Weight

226.796213g

Mounting Hole Diameter

0.156 (3.96mm) 5/32

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

CBP

Published

2002

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Color

Natural

Orientation

Straight

Hole Diameter

3.9624 mm

Holding Type

Snap Fit

Support Hole Diameter

0.156 (3.96mm) 5/32

Length

13.462mm

Length - Overall

0.531 13.50mm

Between Board Height

0.250 6.35mm 1/4

Board Thickness

1.5mm

Support Panel Thickness

0.060 1.50mm

Mounting Panel Thickness

0.060 1.50mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant