Panasonic Electronic Components EVB-NADR15D14

Mount

Through Hole

Mounting Type

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

EVB - Dual

Published

2006

Size / Dimension

Rectangular - 3.465Lx0.591W x 0.315 H 88.00mmx15.00mmx8.00mm

Tolerance

-20% +40%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Resistance

10kOhms

Power (Watts)

0.1W 1/10W

Power Rating

200mW

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

100mW

Adjustment Type

Top

Travel Range

60mm

Fader Type

Dual

Height

8.001mm

Length

88.011mm

Width

15.0114mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Contains Lead