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8949-H88/06BFA

Oupiin 8949-H88/06BFA

Part No:

8949-H88/06BFA

Manufacturer:

Datasheet:

786cbf9e94db9f3aa41dc569dd1568c6

Package:

-

AINNX NO:

32155124-8949-H88/06BFA

Category:

Modular Connectors - Jacks

Description:

Conn Modular Jack RCP 8 POS 2.54mm Solder ST Thru-Hole 8 Terminal 1 Port Tray

Products specifications

Contact Plating
Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.
Gold Over Nickel
Housing Material
Polyester
Number of Terminals
8
Operating Temp Range
-40C to 85C
Positions Loaded
8
Contact Resistance Max
30(mohm)
Mounting Styles
Through Hole
Body Orientation
Straight
Contact Materials
Copper Alloy
Product Depth (mm)
16.5(mm)
Pitch (mm)
2.54(mm)
Termination Method
Solder
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray
Type
Modular Jack
Gender
RCP
Number of Contacts
8(POS)
Housing Color
Black
Number of Ports
A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.
1(Port)
Family
8949-H
Current Rating (Max)
1.5(A)
Product Length (mm)
18.03(mm)
Product Height (mm)
16.4(mm)

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Documents & Media Download datasheets and manufacturer documentation for Oupiin 8949-H88/06BFA.

Datasheets :
786cbf9e94db9f3aa41dc569dd1568c6