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XC7Z100L2FFG900I

Other XC7Z100L2FFG900I

Part No:

XC7Z100L2FFG900I

Manufacturer:

Datasheet:

Package:

-

AINNX NO:

37868743-XC7Z100L2FFG900I

Category:

Embedded - System On Chip (SoC)

Description:

Products specifications

Mount
Through Hole
RoHS
Compliant
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Bulk
Termination
Solder
Number of Rows
2
Pitch
5.08 mm
Orientation
Straight
Number of Contacts
10

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