MIRA030-1RM2WP

OSRAM Opto Semiconductors, Inc. MIRA030-1RM2WP

Part No:

MIRA030-1RM2WP

Datasheet:

-

Package:

32-WFBGA, WLCSP

AINNX NO:

31092014-MIRA030-1RM2WP

Description:

Image Sensors MIRA

Products specifications
  • Package / Case
    32-WFBGA, WLCSP
  • Supplier Device Package
    32-CSP (3.70x3.07)
  • RoHS
    Details
  • Moisture Sensitive
    Yes
  • Factory Pack QuantityFactory Pack Quantity
    72
  • Part # Aliases
    511840002 Q65114A0079
  • Package
    Tray
  • Mfr
    ams OSRAM
  • Product Status
    Active
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    Mira030
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -30°C ~ 85°C (TA)
  • Type
    CMOS
  • Voltage - Supply
    1.4V ~ 1.6V
  • Frames per Second

    used to measure frame rate – the number of consecutive full-screen images that are displayed each second.

    180
  • Pixel Size

    the horizontal and vertical measurements of an image expressed in pixels.

    3.744µm x 3.744µm
  • Active Pixel Array
    640H x 480V
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