Oshino 7839

Mounting Type

Through Hole

Package / Case

Axial

Supplier Device Package

A-405

Series

--

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Speed

Standard Recovery >500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

5µA @ 400V

Voltage - Forward (Vf) (Max) @ If

1.1V @ 1A

Operating Temperature - Junction

-65°C ~ 175°C

Voltage - DC Reverse (Vr) (Max)

400V

Current - Average Rectified (Io)

1A

Capacitance @ Vr, F

15pF @ 4V, 1MHz