HHESD029

OSEPP HHESD029

Part No:

HHESD029

Manufacturer:

OSEPP

Datasheet:

-

Package:

-

AINNX NO:

44332654-HHESD029

Category:

Accessories

Description:

HHESD029

Products specifications
  • Material
    Plastic
  • Factory Pack QuantityFactory Pack Quantity
    900
  • Manufacturer
    Samtec
  • Brand
    Samtec
  • RoHS
    Details
  • Description/Function
    ESD Plastic Bin - C
  • Unit Weight
    1.599999 oz
  • Package
    Bag
  • Mfr
    OSEPP Electronics LTD
  • Product Status
    Active
  • Series
    FTMH
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Type
    ESD Plastic Bin - C
  • Subcategory
    Board to Board & Mezzanine Connectors
  • Usage
    Storage
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Board to Board & Mezzanine Connectors
  • Dimensions - Overall
    9.30 L x 6.10 W x 4.70 H (236.2mm x 154.9mm x 119.4mm)
  • Product
    Accessories
  • Features
    -
  • Product Category

    a particular group of related products.

    Board to Board & Mezzanine Connectors
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