ON Semiconductor MTD15N06V

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

2

Transistor Element Material

SILICON

Package Description

SMALL OUTLINE, R-PSSO-G2

Package Style

SMALL OUTLINE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Manufacturer Package Code

CASE 369C-01

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

175 °C

Rohs Code

No

Manufacturer Part Number

MTD15N06V

Package Shape

RECTANGULAR

Manufacturer

ON Semiconductor

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ON SEMICONDUCTOR

Risk Rank

5.14

Drain Current-Max (ID)

15 A

JESD-609 Code

e0

ECCN Code

EAR99

Terminal Finish

Tin/Lead (Sn/Pb)

Subcategory

FET General Purpose Powers

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

not_compliant

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PSSO-G2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

DRAIN

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

Drain Current-Max (Abs) (ID)

14 A

Drain-source On Resistance-Max

0.12 Ω

Pulsed Drain Current-Max (IDM)

45 A

DS Breakdown Voltage-Min

60 V

Avalanche Energy Rating (Eas)

113 mJ

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

55 W