ON Semiconductor HLMP1700

Mounting Type

Through Hole

Package / Case

Radial

Supplier Device Package

T-1

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2001

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Color

Red

Base Part Number

HLMP1700

Configuration

Standard

Voltage - Forward (Vf) (Typ)

1.8V

Viewing Angle

the angle at which a display can be viewed with acceptable visual performance.

50°

Current - Test

2mA

Lens Style

Round with Domed Top

Lens Size

3mm T-1

Millicandela Rating

2mcd

Lens Transparency

Diffused

Wavelength - Peak

635nm

Lens Color

affect how much visible light reaches people's eyes, how well people see other colors and how well they see contrasts.

Red

Height (Max)

6.30mm