74F403ASPC

ON Semiconductor 74F403ASPC

Part No:

74F403ASPC

Manufacturer:

ON Semiconductor

Datasheet:

Package:

-

AINNX NO:

32334944-74F403ASPC

Description:

Registers FIFO Buffer Memory

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Terminals
    24
  • Manufacturer Part Number
    74F403ASPC
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    ROCHESTER ELECTRONICS LLC
  • Package Description
    DIP,
  • Risk Rank
    5.71
  • Access Time-Max
    20 ns
  • Number of Words
    16 words
  • Number of Words Code
    16
  • Operating Temperature-Max
    70 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE
  • Supply Voltage-Nom (Vsup)
    5 V
  • JESD-609 Code
    e0
  • ECCN Code
    EAR99
  • Terminal Finish
    TIN LEAD
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.71
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54 mm
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    R-PDIP-T24
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Organization
    16X4
  • Seated Height-Max
    5.08 mm
  • Memory Width
    4
  • Memory Density
    64 bit
  • Parallel/Serial
    PARALLEL/SERIAL
  • Output Enable
    YES
  • Length
    31.915 mm
  • Width
    7.62 mm
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