Omron Electronics Inc-EMC Div XG4S-3404

Factory Lead Time

12 Weeks

Housing Material

PBT

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

XG4

Published

2002

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Positions

34

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

105°C

Min Operating Temperature

-55°C

Number of Rows

2

MIL Conformance

YES

DIN Conformance

NO

IEC Conformance

NO

Pitch

2.54mm

Insulation Resistance

The measurement of insulation resistance is carried out by means of a megohmmeter – high resistance range ohmmeter. A general rule-of-thumb is 10 Megohm or more.

1GOhm

Row Spacing

the space needed between rows to allow room for people or farm equipment to get through.

2.54 mm

Connector Support Type

CONNECTOR ACCESSORY

Accessory Type

Strain Relief

Associated Mil-Specs

MIL-C-83503

REACH SVHC

Unknown

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant