OX03C10-E66Y-00LD

OmniVision Technologies Inc OX03C10-E66Y-00LD

Part No:

OX03C10-E66Y-00LD

Datasheet:

-

Package:

-

AINNX NO:

69796491-OX03C10-E66Y-00LD

Description:

2.5MP HDR+LFM IMAGE SENSOR WITH

Products specifications
  • Series
    *
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
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