Ohmite DV-T268-301E

Factory Lead Time

20 Weeks

Package / Case

TO-268

Material

Aluminum

Shape

Rectangular, Fins

Package Cooled

TO-268 (D3Pak)

Material Finish

Degreased

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

D

Published

2015

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Top Mount

Attachment Method

Solderable Feet

Height Off Base (Height of Fin)

0.460 11.68mm

Thermal Resistance @ Forced Air Flow

4.00°C/W @ 700 LFM

Natural Thermal Resistance

4 °C/W

Power Dissipation @ Temperature Rise

7.0W @ 35°C

Height

11.6mm

Length

0.500 12.70mm

Width

1.580 40.13mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant