ODU 172-582-100-201-000

Mounting Type

Surface Mount

Package / Case

2-SMD, J-Lead

Supplier Device Package

SJP

Package

Bulk

Base Product Number

172-582

Mfr

ODU

Product Status

Active

Series

--

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

-

Contact Finish

Silver

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

16 AWG

Speed

Fast Recovery = 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

50µA @ 400V

Voltage - Forward (Vf) (Max) @ If

1.3V @ 3A

Operating Temperature - Junction

-40°C ~ 150°C

Contact Termination

Crimp

Voltage - DC Reverse (Vr) (Max)

400V

Current - Average Rectified (Io)

3A

Capacitance @ Vr, F

--

Pin or Socket

Socket

Reverse Recovery Time (trr)

50ns

Contact Finish Thickness

-