WLAN7207CY

NXP USA Inc. WLAN7207CY

Part No:

WLAN7207CY

Manufacturer:

NXP USA Inc.

Datasheet:

-

Package:

16-WFLGA Exposed Pad

AINNX NO:

28688856-WLAN7207CY

Description:

QFN MODULE

Products specifications
  • Package / Case
    16-WFLGA Exposed Pad
  • Supplier Device Package
    16-HWFLGA (2x2)
  • Mfr
    NXP USA Inc.
  • Package
    Bulk
  • Product Status
    Active
  • Moisture Sensitive
    Yes
  • Factory Pack QuantityFactory Pack Quantity
    10000
  • Part # Aliases
    935420103518
  • Manufacturer
    NXP
  • Brand
    NXP Semiconductors
  • RoHS
    Details
  • Series
    -
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Subcategory
    Wireless & RF Integrated Circuits
  • Frequency
    5.15GHz ~ 7.125GHz
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    RF Front End
  • RF Type

    The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

    WLAN
  • Features
    -
  • Product Category

    a particular group of related products.

    RF Front End
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