NXP USA Inc. TDF8546TH/N2ZJ

Factory Lead Time

30 Weeks

Mounting Type

Surface Mount

Package / Case

36-BSSOP (0.433, 11.00mm Width) Exposed Pad

Usage Level

Automotive grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2010

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Class AB

Voltage - Supply

6V~18V

Output Type

4-Channel (Quad)

Max Output Power x Channels @ Load

25W x 4 @ 4 Ω

Features

Depop, Short-Circuit and Thermal Protection

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant