NXP USA Inc. TDF8546J/N2,112

Factory Lead Time

18 Weeks

Mounting Type

Through Hole

Package / Case

27-SIP Formed Leads

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Operating Temperature (Max.)

105°C

Operating Temperature (Min.)

-40°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

Not Applicable

Number of Terminations

16

Type

Class AB

Voltage - Supply

6V~18V

Terminal Position

ZIG-ZAG

Terminal Pitch

The center distance from one pole to the next.

1mm

Base Part Number

TDF8546

Pin Count

a count of all of the component leads (or pins)

27

JESD-30 Code

R-PZIP-T27

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Output Type

4-Channel (Quad)

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

14.4V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Current-Max

350mA

Max Output Power x Channels @ Load

25W x 4 @ 4 Ω

Features

Depop, Short-Circuit and Thermal Protection

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant