NXP USA Inc. TDA1597/V1,112

Mounting Type

Through Hole

Package / Case

18-DIP (0.300, 7.62mm)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Operating Temperature (Max.)

85°C

Operating Temperature (Min.)

-40°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Published

1997

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

18

Voltage - Supply

7.5V~12V

Terminal Position

DUAL

Peak Reflow Temperature (Cel)

245

Terminal Pitch

The center distance from one pole to the next.

2.54mm

Time@Peak Reflow Temperature-Max (s)

40

JESD-30 Code

R-PDIP-T18

Function

Demodulator, Amplifier

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Supply Voltage-Max (Vsup)

12V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

7.5V

Current - Supply

26mA

Consumer IC Type

AUDIO DEMODULATOR

Signal to Noise Ratio (SNR)

82 dB

Harmonic Distortion

0.1%

Output Voltage-Nom (FM)

200mV

Demodulation Type

FM

Length

21.6mm

Height Seated (Max)

4.7mm

Width

7.62mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant