NX3DV642GU,115

NXP USA Inc. NX3DV642GU,115

Part No:

NX3DV642GU,115

Manufacturer:

NXP USA Inc.

Datasheet:

NX3DV642

Package:

24-XFQFN

ROHS:

AINNX NO:

6326319-NX3DV642GU,115

Description:

IC SWITCH TPDT DIFF XQFN24

Products specifications
  • Factory Lead Time
    7 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    24-XFQFN
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2010
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Applications
    MIPI
  • Base Part Number
    NX3DV642
  • Pin Count

    a count of all of the component leads (or pins)

    QFN
  • Number of Channels
    1
  • -3db Bandwidth
    950MHz
  • On-State Resistance (Max)
    14Ohm
  • Switch Circuit

    establishes connections between links, on demand and as available, in order to establish an end-to-end circuit between devices.

    3PDT
  • Voltage - Supply, Single (V+)
    2.65V~4.3V
  • Features
    Break-Before-Make
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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