NVT2008BQ,115

NXP USA Inc. NVT2008BQ,115

Part No:

NVT2008BQ,115

Manufacturer:

NXP USA Inc.

Datasheet:

NVT2008,2010

Package:

20-VFQFN Exposed Pad

ROHS:

AINNX NO:

5599115-NVT2008BQ,115

Description:

IC TRNSLTR BIDIR 20DHVQFN

Products specifications
  • Factory Lead Time
    14 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    20-VFQFN Exposed Pad
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2003
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • ECCN Code
    EAR99
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    NVT2008
  • Pin Count

    a count of all of the component leads (or pins)

    20
  • Output Type
    Open Drain, Push-Pull
  • Number of Circuits
    1
  • Interface IC Type
    GTL TO TTL TRANSCEIVER
  • Channel Type
    Bidirectional
  • Translator Type
    Voltage Level
  • Voltage - VCCA
    1V~3.6V
  • Voltage - VCCB
    1.8V~5.5V
  • Channels per Circuit
    8
  • Features
    Auto-Direction Sensing
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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