MR2A16ATS35C

NXP USA Inc. MR2A16ATS35C

Part No:

MR2A16ATS35C

Manufacturer:

NXP USA Inc.

Datasheet:

MR2A16A

Package:

44-TSOP (0.400, 10.16mm Width)

ROHS:

AINNX NO:

1790457-MR2A16ATS35C

Category:

Memory

Description:

RAM Miscellaneous MRAM TECHNOLOGY

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    44-TSOP (0.400, 10.16mm Width)
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Published
    2006
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Voltage - Supply
    3V~3.6V
  • Base Part Number
    MR2A16A
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    4Mb 256K x 16
  • Memory Format
    RAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Write Cycle Time - Word, Page
    35ns
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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