NXP USA Inc. MMDS25254HT1

Factory Lead Time

14 Weeks

Mounting Type

Surface Mount

Package / Case

32-VFQFN Exposed Pad

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Frequency

2.3GHz~2.7GHz

Function

Advanced Doherty Alignment Module

RF Type

The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

General Purpose

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant