MC33HB2000ES

NXP USA Inc. MC33HB2000ES

Part No:

MC33HB2000ES

Manufacturer:

NXP USA Inc.

Datasheet:

MC33HB2000

Package:

28-VQFN Exposed Pad

AINNX NO:

5051098-MC33HB2000ES

Description:

H-BRIDGE SPI BRUSHED DC MOTOR

Products specifications
  • Factory Lead Time
    14 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    28-VQFN Exposed Pad
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~125°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Published
    2017
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Applications
    DC Motors, General Purpose
  • Voltage - Supply
    3.3V~5V
  • Interface
    Logic, PWM, SPI
  • Output Configuration
    Half Bridge
  • Voltage - Load
    5V~28V
  • Fault Protection

    Protection against electric shock under. single fault conditions.

    Over Temperature, Short Circuit, UVLO
  • Rds On (Typ)
    235m Ω LS + HS (Max)
  • Load Type
    Inductive
  • Features
    Charge Pump, Slew Rate Controlled, Status Flag
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