MC33GD3100EK

NXP USA Inc. MC33GD3100EK

Part No:

MC33GD3100EK

Manufacturer:

NXP USA Inc.

Package:

32-BSSOP (0.295, 7.50mm Width)

ROHS:

AINNX NO:

3306144-MC33GD3100EK

Description:

IGBT GATE DRIVE IC

Products specifications
  • Factory Lead Time
    8 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    32-BSSOP (0.295, 7.50mm Width)
  • Driver Configuration
    Half-Bridge
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~125°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Voltage - Supply
    5V
  • Channel Type
    Single
  • Number of Drivers
    1
  • Gate Type
    IGBT, N-Channel MOSFET
  • Current - Peak Output (Source, Sink)
    15A 15A
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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