NXP USA Inc. IP4855CX25/C

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

25

Manufacturer Part Number

IP4855CX25/C

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

VFBGA,

Risk Rank

5.61

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Max

5.5 V

Supply Voltage-Nom

2.9 V

Supply Voltage-Min

2.5 V

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.4 mm

Reach Compliance Code

unknown

JESD-30 Code

S-PBGA-B25

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Seated Height-Max

0.55 mm

Interface IC Type

INTERFACE CIRCUIT

Length

2.05 mm

Width

2.05 mm