NXP USA Inc. IP4085CX4/LF,135

Mounting Type

Surface Mount

Package / Case

4-WFBGA, WLCSP

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Diode Element Material

SILICON

Breakdown Voltage / V

16V

Number of Elements

1

Power Dissipation (Max)

1W

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2007

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Applications

General Purpose

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Pin Count

a count of all of the component leads (or pins)

4

JESD-30 Code

S-PBGA-B4

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Polarity

UNIDIRECTIONAL

Configuration

SINGLE

Number of Circuits

1

Diode Type

TRANS VOLTAGE SUPPRESSOR DIODE

Clamping Voltage-Max

20V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant