FRDM-STBC-AGM04

NXP USA Inc. FRDM-STBC-AGM04

Part No:

FRDM-STBC-AGM04

Manufacturer:

NXP USA Inc.

Package:

-

ROHS:

AINNX NO:

6177592-FRDM-STBC-AGM04

Description:

FRDM BOARD FORMMA8652/MAG311

Products specifications
  • Factory Lead Time
    14 Weeks
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Box
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Utilized IC / Part
    FXAS21002C, MAG3110, MMA8652FC
  • Supplied Contents
    Board(s)
  • Sensor Type
    Accelerometer, Gyroscope, Magnetometer, 3 Axis
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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