NXP USA Inc. BGU8052X

Factory Lead Time

13 Weeks

Mounting Type

Surface Mount

Package / Case

8-WFDFN Exposed Pad

Usage Level

Industrial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2010

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Voltage - Supply

4.75V~5.25V

Frequency

1.5GHz~2.5GHz

Pin Count

a count of all of the component leads (or pins)

8

Test Frequency

a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

1.9GHz

Current - Supply

48mA

Gain

18.5dB

RF/Microwave Device Type

WIDE BAND LOW POWER

RF Type

The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

GSM, LTE, W-CDMA

Noise Figure

Noise figure (NF) and noise factor (F) are measures of degradation of the signal-to-noise ratio (SNR), caused by components in a signal chain.

0.5dB

P1dB

18dBm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant