NXP USA Inc. BFU730LXZ

Factory Lead Time

13 Weeks

Mounting Type

Surface Mount

Package / Case

3-XFDFN

Current-Collector (Ic) (Max)

30mA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2010

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Base Part Number

BFU730

Pin Count

a count of all of the component leads (or pins)

3

Power - Max

160mW

Transistor Type

NPN

DC Current Gain (hFE) (Min) @ Ic, Vce

205 @ 2mA 3V

Gain

15.8dB

Voltage - Collector Emitter Breakdown (Max)

3V

Frequency - Transition

53GHz

Noise Figure (dB Typ @ f)

0.75dB @ 6GHz

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant