NXP USA Inc. 74LVC04APW

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

14

Package Description

TSSOP, TSSOP14,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels

1

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP14,.25

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Rohs Code

Yes

Manufacturer Part Number

74LVC04APW

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

PHILIPS SEMICONDUCTORS

Risk Rank

4.45

Prop.

6 ns

Subcategory

Gates

Packing Method

TUBE

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Terminal Pitch

The center distance from one pole to the next.

0.635 mm

Reach Compliance Code

unknown

JESD-30 Code

R-PDSO-G14

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

3.3 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

AUTOMOTIVE

Logic IC Type

INVERTER

Max I(ol)

0.024 A

Schmitt Trigger

NO