74AHC244PW,112

NXP USA Inc. 74AHC244PW,112

Part No:

74AHC244PW,112

Manufacturer:

NXP USA Inc.

Datasheet:

-

Package:

20-TSSOP (0.173", 4.40mm Width)

AINNX NO:

28824398-74AHC244PW,112

Description:

IC BUF NON-INVERT 5.5V 20TSSOP

Products specifications
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    20-TSSOP
  • Standard Package
    75
  • Product Training Modules
    Logic Packages
  • Number of Elements
    2
  • Package
    Bulk;Bulk;
  • Base Product Number
    74AHC244
  • Mfr
    NXP USA Inc.
  • Product Status
    Active
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40掳C ~ 125掳C
  • Series
    74AHC
  • Voltage - Supply
    2 V ~ 5.5 V
  • Family
    Logic - Buffers, Drivers, Receivers, Transceivers
  • Current - Output High, Low
    8mA, 8mA
  • Logic Type
    Buffer/Line Driver, Non-Inverting
  • Number of Bits per Element
    4
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