PMD3001D

NXP Semiconductors / Freescale PMD3001D

Part No:

PMD3001D

Datasheet:

-

Package:

-

ROHS:

AINNX NO:

16361457-PMD3001D

Description:

NXP PMD3001DBipolar Transistor Array, NPN, PNP, 40 V, 330 mW, 1 A, 450, SuperSOT

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    6
  • Collector-Emitter Breakdown Voltage
    40V
  • Number of Elements
    2
  • Power Dissipation (Max)
    580mW
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    9 ns
  • hFEMin
    50
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    6
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin (Sn)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    150°C
  • Min Operating Temperature
    -65°C
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Pin Count

    a count of all of the component leads (or pins)

    6
  • Number of Outputs
    1
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Polarity
    NPN, PNP
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Dual
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    330mW
  • Current - Output
    1A
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    20 ns
  • Transistor Application
    AMPLIFIER
  • Rise Time

    In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

    17ns
  • Fall Time (Typ)
    6 ns
  • Collector Emitter Voltage (VCEO)
    40V
  • Number of Drivers
    2
  • Collector Current-Max (IC)
    1A
  • DC Current Gain-Min (hFE)
    300
  • Max Junction Temperature (Tj)
    150°C
  • Ambient Temperature Range High

    This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.

    150°C
  • Height
    1.1mm
  • REACH SVHC
    No SVHC
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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