NXP Semiconductors S9S12B256F0CPVER

Case/Package

LQFP

Memory Types

FLASH

RoHS

Compliant

Watchdog Timers

Yes

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel

Interface

CAN, I2C, SCI, SPI

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

256 kB

RAM Size

8 kB

Data Bus Width

16 b

Halogen Free

Halogen Free

Number of Timers/Counters

8

Max Frequency

50 MHz

Number of Programmable I/O

91

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No