NXP Semiconductors PSMN017-30KL

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

8

Transistor Element Material

SILICON

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

SOIC

Package Description

PLASTIC, MS-012, SOP-8

Drain Current-Max (ID)

10 A

Number of Elements

1

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

ECCN Code

EAR99

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

8

JESD-30 Code

R-PDSO-G8

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

JEDEC-95 Code

MS-012AA

Drain-source On Resistance-Max

0.025 Ω

Pulsed Drain Current-Max (IDM)

40 A

DS Breakdown Voltage-Min

30 V

Avalanche Energy Rating (Eas)

26 mJ

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

3 W