NXP Semiconductors PMEG3050BEP,115

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Diode Element Material

SILICON

Number of Terminals

2

Exterior Housing Material

1

Rohs Code

Yes

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

SOD

Package Description

PLASTIC PACKAGE-2

Manufacturer Package Code

SOD128

Forward Voltage-Max (VF)

0.45 V

Operating Temperature-Max

150 °C

Operating Temperature-Min

-55 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

JESD-609 Code

e3

Terminal Finish

TIN

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

not_compliant

Time@Peak Reflow Temperature-Max (s)

30

Pin Count

a count of all of the component leads (or pins)

2

Reference Standard

AEC-Q101; IEC-60134

JESD-30 Code

R-PDSO-F2

Configuration

SINGLE

Diode Type

RECTIFIER DIODE

Output Current-Max

5 A

Number of Phases

1

Rep Pk Reverse Voltage-Max

30 V

Non-rep Pk Forward Current-Max

70 A

Reverse Current-Max

250 μA

Output Range

0.625 W

2nd Connector Number of Positions Loaded

EFFICIENCY

Saturation Current

1