NXP Semiconductors PDTC124ET

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

3

Transistor Element Material

SILICON

Rohs Code

Yes

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

SOT-23

Package Description

PLASTIC PACKAGE-3

Moisture Sensitivity Levels

1

Number of Elements

1

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Transition Frequency-Nom (fT)

100 MHz

JESD-609 Code

e3

Pbfree Code

Yes

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

BUILT IN BIAS RESISTANCE RATIO IS 1

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

30

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PDSO-G3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE WITH BUILT-IN RESISTOR

Transistor Application

SWITCHING

Polarity/Channel Type

NPN

JEDEC-95 Code

TO-236AB

Power Dissipation-Max (Abs)

0.25 W

Collector Current-Max (IC)

0.1 A

DC Current Gain-Min (hFE)

60

Collector-Emitter Voltage-Max

50 V

VCEsat-Max

0.3 V

Collector-Base Capacitance-Max

3.5 pF