NXP Semiconductors PDI1394P11AEC

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

64

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

BGA

Package Description

LFBGA,

Clock Frequency-Max

24.578 MHz

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2.7 V

Supply Voltage-Nom

3.3 V

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.31.00.01

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

64

JESD-30 Code

S-PBGA-B64

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL

uPs/uCs/Peripheral ICs Type

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Seated Height-Max

1.5 mm

Boundary Scan

NO

Low Power Mode

NO

Number of Serial I/Os

6

Data Transfer Rate-Max

25 MBps

Communication Protocol

MIL STD 1553A; MIL STD 1553B

Length

8 mm

Width

8 mm