NXP Semiconductors P1025NSE5DFB

Factory Lead Time

4 Weeks

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

561

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

BGA-561

Moisture Sensitivity Levels

3

Operating Temperature-Max

125 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA561,27X27,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Max

1.05 V

Supply Voltage-Min

0.95 V

Supply Voltage-Nom

1 V

Pbfree Code

Yes

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

260

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

40

JESD-30 Code

S-PBGA-B561

uPs/uCs/Peripheral ICs Type

SoC

Seated Height-Max

2.3 mm

Length

23 mm

Width

23 mm