NXP Semiconductors MPR031EP

ECCN (US)

EAR99

Number of Keys

3 Key

Synchronous Pin

Yes

Maximum Load Capacitance (pF)

400

Maximum Response Time (ms)

32(Typ)

Maximum Rise Time (ns)

300

Maximum Fall Time (ns)

300

Spread Spectrum

No

Interface Type

I2C

Minimum Operating Supply Voltage (V)

1.71

Maximum Operating Supply Voltage (V)

2.75

Maximum Low Level Output Voltage (V)

0.5

Minimum Operating Temperature (°C)

-40

Automotive

No

Maximum Operating Temperature (°C)

85

Standard Package Name

DFN

Supplier Package

UDFN

Mounting

Surface Mount

Package Height

0.6(Max)

Package Length

2

Package Width

2

PCB changed

8

Lead Shape

No Lead

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Capacitive

Pin Count

a count of all of the component leads (or pins)

8

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant