MCM63P733ATQ90

NXP Semiconductors MCM63P733ATQ90

Part No:

MCM63P733ATQ90

Manufacturer:

NXP Semiconductors

Datasheet:

Package:

-

AINNX NO:

69084470-MCM63P733ATQ90

Category:

Memory

Description:

Cache SRAM

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    100
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    NXP SEMICONDUCTORS
  • Package Description
    LQFP,
  • Access Time-Max
    5 ns
  • Number of Words
    131072 words
  • Number of Words Code
    128000
  • Operating Temperature-Max
    70 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    LQFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, LOW PROFILE
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • ECCN Code
    3A991.B.2.A
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    PIPELINED ARCHITECTURE
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.41
  • Terminal Position
    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65 mm
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    R-PQFP-G100
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Supply Voltage-Min (Vsup)
    3.135 V
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Organization
    128KX32
  • Seated Height-Max
    1.6 mm
  • Memory Width
    32
  • Memory Density
    4194304 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    CACHE SRAM
  • Length
    20 mm
  • Width
    14 mm
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