NXP Semiconductors BZX384-C33

Mount

Surface Mount

Number of Pins

2

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape

Tolerance

5 %

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150 °C

Min Operating Temperature

-65 °C

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

300 mW

Voltage

33 V

Impedance

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

80 Ω

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Current

25 A

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

300 mW

Forward Current

Current which flows upon application of forward voltage.

100 mA

Max Reverse Leakage Current

50 nA

Test Current

2 mA

Zener Voltage

33 V

Reverse Voltage

the voltage drop across the diode if the voltage at the cathode is more positive than the voltage at the anode

23.1 V

Max Junction Temperature (Tj)

150 °C

Ambient Temperature Range High

This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.

150 °C

Height

1.1 mm

Length

1.8 mm

Width

1.35 mm

REACH SVHC

No SVHC