NXP Semiconductors BY228/21

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Diode Element Material

SILICON

Number of Terminals

2

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

O-LADB-W2

Number of Elements

1

Package Body Material

GLASS

Package Shape

ROUND

Package Style

DISK BUTTON

ECCN Code

EAR99

Applications

GENERAL PURPOSE

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

LOW LEAKAGE CURRENT

Terminal Position

AXIAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

WIRE

Reach Compliance Code

unknown

JESD-30 Code

O-LADB-W2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Diode Type

RECTIFIER DIODE

Case Connection

ISOLATED

Number of Phases

1

Rep Pk Reverse Voltage-Max

1650 V

Non-rep Pk Forward Current-Max

50 A

Reverse Recovery Time-Max

1 µs