NXP Semiconductors BUK9Y8R5-80EX

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Material

aluminium

Exterior Housing Material

1

Type of heatsink

extruded

Heatsink shape

U

Material finishing

anodized

Mounting

for back plate

Rohs Code

Yes

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

SOIC

Manufacturer Package Code

SOT669

Drain Current-Max (ID)

100 A

Operating Temperature-Max

175 °C

JESD-609 Code

e3

ECCN Code

EAR99

Terminal Finish

TIN

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

not_compliant

Time@Peak Reflow Temperature-Max (s)

30

Pin Count

a count of all of the component leads (or pins)

4

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Polarity/Channel Type

N-CHANNEL

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

238 W

2nd Connector Number of Positions Loaded

LED

Saturation Current

1

Length

80mm

Width

57.2mm

Height

40mm

Diameter

68.5mm