NXP Semiconductors BSH205G2R

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

3

Transistor Element Material

SILICON

Exterior Housing Material

1

Glue

high-adhesion glue

Type of integrated circuit

interface

Kind of integrated circuit

digital isolator

Data transfer rate

150Mbps

Mounting

SMD

Case

SOP8

Kind of channel

unidirectional

Rohs Code

Yes

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

TO-236

Package Description

ROHS COMPLIANT, PLASTIC PACKAGE-3

Manufacturer Package Code

SOT23

Drain Current-Max (ID)

2 A

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

ECCN Code

EAR99

Type

Polyimide tape single-sided

Color

yellow metallic

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

a count of all of the component leads (or pins)

3

Reference Standard

AEC-Q101; IEC-60134

JESD-30 Code

R-PDSO-G3

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Transistor Application

SWITCHING

Polarity/Channel Type

P-CHANNEL

JEDEC-95 Code

TO-236AB

Drain-source On Resistance-Max

0.17 Ω

DS Breakdown Voltage-Min

20 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Features

dismantling at a temperature of 260 - 300 °C without a trace

Width

50 mm

Thickness

0.05 mm